ON semiconductor
D2PAK , SOD123 -> Assembly Change
1. PCN Action & Follow up:
|
Follow up item |
Check |
|
PCN receive date |
2020/4/30 |
|
PCN Issue date |
2020/4/29 |
|
Estimated
date of changed product first shipment |
05
Aug 2020 or earlier if approved by customer |
|
Brand |
ON |
|
PCN Number |
FPCN23038X |
|
PCN Change Type |
Assembly
Change |
|
Reasons of change |
ON
Semiconductor (Seremban, Malaysia), ICD2PAK 3LD mold compound qualification
from G600 to G700HF. |
|
ACTION |
(3)
âÍë¦PM/Salesü¬ìã
ps. åýSales
or PM ü¬ìãÜôâÍ÷×ò±ËÔûÂ&áêåÆ/ã¯ìã,
即òÁïÈüÞÜÝ, öÎPCNÌ¿äÐ即ʦ. |
|
ì«÷×ò±ËÔûÂ-Date |
(SalesüÞ填Date) |
|
ËÔûÂüÞÜÝì«â¥Óð-Date |
(SalesüÞ填Date) |
|
ë¦Salse or PM
ü¬ìããÀÜúé©ãéôëSample - áêåÆ
if yes:
(a)Salesú¾VendorãéôëSample
(b)SalesèÇà÷áêåÆÐåËÔû |
(SalesüÞ填Date) |
|
ë¦Salse or PM
ü¬ìããÀÜúé©ð²íÂã¯ìãßö
if
yes: (a)ôësales ú¾ã¯ìãßöteamð«õóãéôë&並÷×ΦËÔûÂü¬ìã |
(SalesüÞ填Date) |
|
PCN Closed (ì«Ì¿äÐ, öèß¾X) |
(SalesüÞ填Date) |
2. PCN
Action & Follow up:
|
Follow up item |
Check |
|
PCN receive date |
2020/4/24 |
|
PCN Issue date |
2020/4/24 |
|
Estimated
date of changed product first shipment |
31
Jul 2020 or earlier if approved by customer |
|
Brand |
ON |
|
PCN Number |
FPCN23066X |
|
PCN Change Type |
Assembly
Change |
|
Reasons of change |
Henkel
Green Compound 2nd source Qualification for SOD123, SOT553, SOT563, SOT143
and SC59 package. |
|
ACTION |
(3)
âÍë¦PM/Salesü¬ìã
ps. åýSales or PM ü¬ìãÜôâÍ÷×ò±ËÔûÂ&áêåÆ/ã¯ìã, 即òÁïÈüÞÜÝ, öÎPCNÌ¿äÐ即ʦ. |
|
ì«÷×ò±ËÔûÂ-Date |
(SalesüÞ填Date) |
|
ËÔûÂüÞÜÝì«â¥Óð-Date |
(SalesüÞ填Date) |
|
ë¦Salse or PM
ü¬ìããÀÜúé©ãéôëSample - áêåÆ
if yes:
(a)Salesú¾VendorãéôëSample
(b)SalesèÇà÷áêåÆÐåËÔû |
(SalesüÞ填Date) |
|
ë¦Salse or PM
ü¬ìããÀÜúé©ð²íÂã¯ìãßö
if
yes: (a)ôësales ú¾ã¯ìãßöteamð«õóãéôë&並÷×ΦËÔûÂü¬ìã |
(SalesüÞ填Date) |
|
PCN Closed (ì«Ì¿äÐ, öèß¾X) |
(SalesüÞ填Date) |
Á¶È¸ : 555
